12 September 2008

Spiricon Inc Introduces Industry?s Largest Area Laser Beam Profiling System - Up to 24 x 36 mm with Versatile USB 2.0 Interface

Spiricon, the global leader in precision laser measurement equipment, has recently announced the USB L11058 Large Format Beam Profiling Camera. The USB L11058 camera is designed for measuring large ultraviolet laser beams. It’s high resolution, 4008 x 2672 pixel format allows profiling of beams up to 24 x 36 mm without requiring reduction optics. Frame rates of up to 3.1 frames per second at full resolution increase throughput and productivity. This makes the USB L11058 ideal for use in applications that require a large field of view, fast frame rates, low noise, and high responsivity, such as high power lasers in semiconductor fabrication.

The USB L11058 Large Format Beam Profiling Camera accurately measures CW (continuous wave) laser beams over an extensive spectral range, from 190 nm to 1100 nm. The camera also has a wide dynamic range of 59 dB. The camera features a global shutter which allows simultaneous integration of the entire pixel array; its short exposure time is ideal for capturing objects in high speed motion. An integrated USB 2.0 digital interface allows users to transfer measurement
data to laptops and desktop computers.

The USB L11058 Beam Profiling Camera works with the industry’s most advanced beam analysis software, Spiricon’s LBA. LBA software contains all the algorithms and calculations necessary to make the most accurate laser beam measurements and an ActiveX® interface to extract data into other applications. LBA also offers 2D and 3D viewing, reference subtraction, user-customized apertures and colour palettes, and Z-axis scaling. “The USB L11058 is the industry’s largest area laser beam profiling camera on the market,” stated Gary Wagner, President, Spiricon, Inc. “This innovation allows large laser applications, that were previously unable to capture and analyze beams with diameters larger than a few millimeters, to accurately measure beam profiles and widths, understand power density and cavity alignment, and significantly improve the quality of the finished products.”

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