Magazine Articles
The articles below are from the Autumn 2009 Issue of the AILU Magazine
Metal powder bed Additive Layer Manufacturing: the good, the bad and the ugly
There are a number of different names and acronyms for the many essentially identical powder bed Additive Layer Manufacturing (ALM) processes - ALM is used here. The first description of the process as presently operated is in US patent 4,247,508 issued in 1982 to Ross Housholder. However, it is only recently; with the development of suitable lasers and the widespread use of 3D CAD, together with computer and software developments, that the process has become economically and technically viable for metals.
The ALM process should be seen as an additional manufacturing technology for integrating into existing strategies, not a replacement. When integrated with EDM, conventional machining, heat treating and hand finishing it can produce at a viable cost in particular situations (especially low volume/rapid turnaround) ‘castings’ type designs in certain high specification materials with properties similar to manufacture by forging. It can also produce some integrated structures not otherwise possible to fabricate without the aid of joining techniques. ALM offers huge potential for further technical development and cost reduction to broaden the economic applications base and fulfil its early promise.
Carl Brancher
Materials Solutions
IMAGE: A test structure consisting of a ‘staircase’ of steps at 10º increases from horizontal to vertical. Analysis shows that under-surface roughness increases as the inclination of the steps decreases; the under-surfaces of steps at less than 30 degrees would generally be regarded as unusable rough., except of course for the bottom step at zero degrees.
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Light-emitting polymer pixels deposited by laserinduced forward transfer

Flatter screens and increasingly luminous and brilliant colour displays characterise the appearance of modern electronic devices. A next innovation step will be the development of flexible plastic displays which are no longer based on rigid carriers. Innovative laser-based micro-fabrication techniques in conjunction with organic semiconductor materials as well as functional polymers open up new possibilities for ‘plastic electronics’. One such technique is Laser Induced Forward Transfer (LIFT).
LIFT uses a UV pulsed laser with a special UV-light absorbing polymer film which serves as a sacrificial release layer. In this way a thin solid material layer is forward transferred from a transparent donor substrate onto a receiver substrate. The process has the potential for accurately depositing thin films and printing successive layers of organic materials via a direct-write process.
Thus far, the applications for the photosensitive special polymers as the absorbing sacrificial release layer in the laser catapulting process are still in the early research and development stage. The emergence of flexible plastic monitors may still be a few years away but it is already clear that ultra-thin OLED and polymer displays will rival the current leaders in the digital display market.
Thomas Lippert, Matthias Nagel, Romain Fardel and Frank A. Nüesch
Materials Group of the Paul Scherrer Institut (T.L.), and the Laboratory for Functional Polymers, EMPA Materials Science & Technology, Dübendorf, Switzerland
IMAGE: Magnified pixel structure of an LCD full colour display. Every three adjacent sub-pixels – red, green and blue – form a square pixel with a size of typically 0.3 to 0.2 mm.
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