TRUMPF entered the femtosecond laser market comparatively recently yet it has now introduced a brand new model that is already challenging the market leaders. This technology is ideal for the cold processing of materials at very high average output power.
Naturally, the new TruMicro 5070 Femto Edition inherits the exceptional stability of both the laser pulses and power established by its forerunner to ensure continued high performance in this field. It offers pulse duration of 800 ± 200 femtoseconds and pulse energy as high as 200 microjoules with repetition rates at 400 and 600 kHz.
This new ultrashort pulse laser is optimally designed for industrial use, promising reliability and accuracy even in a three-shift operation. The process reliability is achieved by means of a patented double feedback loop which guarantees that exactly the specified power level is applied and the beam quality and pulse duration remain constant.
The short pulse duration is advantageous, especially when processing temperature-sensitive materials such as composites and polymers. The TruMicro 5070 Femto Edition and its predecessor are the ideal tools for the cold processing of these substrates as their shorter pulse duration means the material absorbs less thermal energy. In this way, the high mean power can be applied to the work piece.
These qualities predestine the TruMicro 5070 Femto Edition for demanding production in the microchip and electronic industries and also in medical technology. Early applications include drilling holes in circuit boards and processing polymers to be used as medical implants.
Initial trails with nitinol, a shape-memory alloy used, for example, in medical technology to manufacture stents have also resulted in superior cutting without any need for reworking. This is due, to a large extent, to the superior beam quality of the TruMicro 5000 Series of M2 <1.3.
The performance of the TruMicro 5070 Femto Edition makes it among the most productive infrared femtosecond lasers on the market with very high throughput rates for processing components. Indeed the combination of pulse energy, pulse shape and mean power allows the model to achieve significantly higher ablation rates for many materials.