Oxford Lasers has announced the successful award of a collaborative research and development (R&D) grant from Innovate UK, namely the INTERPOSE-UK project (advanced INTegratEd ciRcuit interPOsers for SEmiconductor packaging in the UK).
In partnership with BAE Systems, the University of Southampton and PRP Optoelectronics, Oxford Lasers will provide high-precision laser processing for the development of advanced features in glass interposers. Interposers are functional substrates that enable electrical connectivity between different semiconductor chips in advanced packaging applications.
The consortium’s goal is to mature the bespoke manufacture of glass and silicon-based interposers/redistribution layers and make them commercially available to a wide range of end-user applications beyond consumer products in support of the UK packaging supply chain. The intention is to offer an agile process flow, capable of supporting a variety of niche requirements and not a single restricted application offering.
Dr. Dimitris Karnakis, Senior Manager Technology, Oxford Lasers, stated “The UK government is investing in semiconductor manufacturing to ensure resilience and technological leadership in this area”. Dr. Karnakis continued “This nearly half a million pound grant will enable Oxford Lasers and the INTERPOSE-UK partners to advance next generation chip integration using glass and silicon passive interposers. For our part, Oxford Lasers will be developing new laser processing technologies to fabricate custom through glass vias that will enable advanced 2.5D and 3D heterogeneous integration”.
He highlighted the impact of the project’s results by commenting “Next generation heterogeneous chip integration through the use of bespoke interposers will have a substantial impact in every area involving semiconductors including high-performance computing, optoelectronics, power, aerospace, defence, sensors, and automotive, among others.”
Contact: Dimitris Karnakis